Electronic power system and method for manufacturing the same

ABSTRACT

The invention relates to an electronic power system ( 1 ) comprising at least one electronic power module ( 2 ). The electronic power module ( 2 ) comprises a base plate ( 3 ) and at least one heat generating component arranged on a first side of the base plate ( 3 ). The electronic power module ( 2 ) comprises a cooling structure ( 4 ) transporting heat away from the electronic power module ( 2 ) via a coolant that is guided by the cooling structure ( 4 ). The cooling structure ( 4 ) is arranged on a second side ( 5 ) of the base plate ( 3 ) opposite to the first side. Task of the invention is to provide an electronic power system ( 1 ) with an improved cooling. According to the present invention this task is solved in that the cooling structure ( 4 ) is integrally formed with the base plate ( 3 ).

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a National Stage application of International PatentApplication No. PCT/EP2017/084484 filed on Dec. 22, 2017, which claimspriority to German Patent Application No. 10 2017 101 126.9 filed Jan.20, 2017 each of which is hereby incorporated by reference in itsentirety.

TECHNICAL FIELD

The invention relates to an electronic power system comprising at leastone electronic power module, wherein the electronic power modulecomprises a base plate and at least one heat generating componentarranged on a first side of the base plate, wherein the electronic powermodule comprises a cooling structure for transporting heat away from theelectronic component via a coolant that is guided by the coolingstructure, and wherein the cooling structure is arranged on a secondside of the base plate opposite to the first side.

BACKGROUND

The coolant can be any of a number of different fluids known in thefield. Typically, water, with or without minor additives to controlcorrosion or conductivity, may be used. Alternatively, a material whichis designed to undergo a phase transition during the cooling cycle maybe used, to form a phase-change or two-phase cooling system. Such asystem is a very efficient method of cooling, and comprises some form ofcompressor to compress the coolant from a gas into a liquid. This liquidis led through a heat dissipation device, such as a condenser, whichremoves heat from the liquid, and then on to the cooling structure afterit passes through an expansion device which vaporises the liquid. Theevaporating liquid undergoes a phase change and absorbs heat from thecooling structure in the process. The gas is then led through thecompressor and the cycle begins again.

SUMMARY

The invention furthermore relates to a method for manufacturing anelectronic power module of the above kind.

Traditionally electronic power modules in electronic power systems areassembled by having a heat generating component directly or indirectlymounted on a first side of the base plate. The heat generating componentis then usually encapsulated to the outside in a molding compound whichalso covers the rest of the first side of the base plate.

Separate members comprising cooling structures may then be attached toeither or both sides of the electronic power modules to transport heataway from the electronic power module. However, this setup has severaldisadvantages in particular if a strong cooling is required. If acooling structure using a coolant is attached to the second side of thebase plate the coolant will be guided through the cooling structure toabsorb excess heat and transport it away from the electronic powermodule. An efficient cooling however requires a high flow speed of thecoolant which is achieved by providing the coolant at a high pressurevia a pump. Due to this the electronic power module will be subject tohigh pressure forces that can vary due to pressure pulses caused by thepump. Consequently, the electronic power module needs to be stabilizedto avoid micro fractures which is commonly achieved by using thickerbase plates to prevent a premature mechanical failure of the electronicpower module. This, on the other hand, increases the volume, thicknessand weight of the electronic power module.

Task of the invention is therefore to provide an electronic power systemwith an improved cooling.

According to the present invention the above task is solved in that thecooling structure is integrally formed with the base plate.

Consequently, the base plate and the cooling structure are not separatemembers that are only fixed to one another during assembly, but thecooling structure is an integral part of the base plate. This way, thecooling structure can add to the stiffness of the base plate moreeffectively and the overall height of the combination of base plate andcooling structure may be reduced compared to the state of the artwithout a loss of stability of the electronic power module.

In an embodiment, the cooling structure comprises at least one wallstructure for stiffening the base plate and directing a coolant alongthe cooling structure. Each wall structure may be a combination of wallelements connected to one another. The at least one wall structure canalso guide the flow of coolant from at least one cooling structure inletto at least one cooling structure outlet. Wall structures provide morestability and stiffening to the base plate than isolated pin-fins. In anembodiment, the at least one wall structure changes direction in theplane of the cooling structure parallel to the second surface. Thechange in direction may be gradually or abruptly or both at differentlocations of the wall structure. In other words, parts of the wallstructure may be straight and other parts may, for example, be curved.

In an embodiment, one of the wall structures comprises at least onestabilizing wall element, wherein the stabilizing wall element doeschange direction for at least one third of the extension of the baseplate along that direction. This embodiment ensures that at least partof the at least one wall structure adds significantly to the stiffnessand stability of the base plate. If the cooling structure comprisesseveral stabilizing wall elements of this kind then the stiffness of thewhole base plate will approach that of a massive base plate of the samethickness. In an embodiment, the at least one stabilizing wall elementdoes not change direction for at least one half of the extension of thebase plate along that direction. In an embodiment, at least onestabilizing wall element does not change direction for the fullextension of the base plate along that direction.

In an embodiment, the electronic power system comprises at least twostabilizing wall elements that are arranged at a relative angle between60° and 120°. This embodiment ensures that at least two stabilizing wallelements are arranged nearly perpendicular in the plane of the coolingstructure and thereby ensure a sufficient overall stiffness andstability of the base plate.

In an embodiment, the cooling structure is limited in the plane of thecooling structure by at least three stabilizing wall elements. Dependingon the shape of the base plate a number of stabilizing wall elements maythus limit the cooling structure and thus the flow of coolant in theplane of the cooling structure. The base plate may be rectangular inwhich case the cooling structure may be limited by four stabilizing wallelements which meet in the corners of the cooling structure.

In an embodiment, the cooling structure comprises at least two wallstructures that form an interleaved comb pattern for guiding the flow ofthe coolant along the cooling structure and stabilizing the base plate.An interleaved comb pattern is effective at providing both an uniformcooling and a high stiffness of the base plate. The interleaved combpattern may be formed between two neighboring stabilizing wall elements.The neighboring stabilizing wall elements may run parallel but can alsobe arranged at an angle relative to one another.

In an embodiment, the cooling structure comprises both wall structuresand transversally isolated pins. The cooling structure may furthermorecomprise pins which are connected to at least one of the wallstructures.

In an embodiment, the cooling structure comprises at least three wallstructures each of which comprises at least one stabilizing wallelement, wherein the at least three stabilizing wall elements extendradially towards a common center location. The common center locationdoes not necessarily need to be arranged in the geometrical center ofthe base plate. In case the base plate has a certain symmetry it may,however, be advantageous to arrange the common center location in thegeometrical center of the plane of the cooling structure. Arranging atleast three stabilizing wall elements in a radial arrangement towards acommon center location provides a high stability to the base plate.Furthermore, in this embodiment the cooling structure inlet may bearranged above the common center location such that the center of thebase plate receives the strongest cooling. The latter may be desirablein applications where the most heat is produced in the center of theelectronic power module. The cooling structure may in this embodimentcomprise further, non-radially arranged stabilizing wall elements.

In an embodiment, the wall structures form a polar comb pattern betweenneighboring stabilizing wall elements around the common center location.In this embodiment, the flow of the coolant may then enter the coolingstructure near the common center location and then flow radiallyoutwards meandering through the polar comb pattern arranged betweenneighboring stabilizing wall elements until it reaches the coolingstructure outlet.

In an embodiment, the electronic power system comprises at least twoelectronic power modules and a common coolant distributor, wherein thecommon coolant distributor comprises at least one distributor inlet andat least one distributor outlet connected to each electronic powermodule. Each distributor inlet may be connected to one or more coolingstructure outlets and each distributor outlet may be connected to one ormore cooling structure inlets and vice versa.

In an embodiment, the common coolant distributor comprises individualdepressions for receiving each electronic power module, wherein eachdepression comprises at least one distributor inlet and at least onedistributor outlet.

The above task is also solved by a method for manufacturing anelectronic power system comprising at least one electronic power module,wherein the electronic power module comprises a base plate and at leastone heat generating component arranged on a first side of a base plate,wherein the electronic power module comprises a cooling structure fortransporting heat away from the electronic power module via a coolantthat is guided by the cooling structure, and wherein the coolingstructure is arranged on a second side of the base plate opposite to thefirst side, comprising the steps:

-   -   Providing a raw base plate,    -   forming a cooling structure on the second side of the raw base        plate such that the cooling structure is an integral part of the        base plate,    -   fixing the at least one heat generating component to the first        side.

In an embodiment, the cooling structure is formed by cold forging theraw base plate. The cooling structure may, for example, be stamped intothe raw base plate. Depending on the material of the base plate coldforging may be more cost efficient than other methods of manufacture.Alternatively, the cooling structure may be formed by hot forging,etching, milling, 3D printing, additive manufacturing, sintering,injection molding, casting or eroding. These alternative methods may beused in particular if the material of the base plate is not suitable forcold forging or if the shape of the cooling structure is difficult toachieve by cold forging.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention will now be described withreference to the figures, wherein:

FIG. 1 shows a top view of an electronic power module as part of anelectronic power system according to the invention,

FIG. 2 shows a second embodiment of an electronic power module as partof an electronic power system according to the invention,

FIG. 3A+3B show a third embodiment of an electronic power module as partof an electronic power system according to the invention,

FIG. 4 shows a common coolant distributor as part of an electronic powersystem according to the invention,

FIG. 5 shows a fourth embodiment of a base plate of an electronic powersystem according to the invention,

FIG. 6 shows a fifth embodiment of a base plate as part of an electronicpower system according to the invention,

FIG. 7 shows an arrangement of twelve adjacent base plates according tothe embodiment of FIG. 6,

FIG. 8 shows the embodiment according to FIG. 7 together with a matchingcommon coolant distributor,

FIG. 9 shows a flow diagram of the method of manufacture according tothe invention.

DETAILED DESCRIPTION

FIG. 1 shows a simplified depiction of an electronic power system 1according to a first embodiment of the invention. The electronic powersystem 1 comprises an electronic power module 2 having a base plate 3.The electronic power module 2 furthermore comprises a heat generatingcomponent arranged on a first side of a base plate 3, which is notvisible from the shown angle. The electronic power module 2 furthermorecomprises a cooling structure 4 which is arranged on a second side 5 ofthe base plate 3.

The cooling structure 4 is integrally formed with the base plate 3. Bothmay be manufactured from a common raw base plate, for example, by coldforging. Alternatively, the cooling structure 4 may also be formed byhot forging, etching, milling, 3D printing, additive manufacturing,sintering, injection molding, casting or eroding.

In this embodiment the cooling structure 4 comprises three wallstructures 6 as well as transversally isolated pins 7. Furthermore, somepins 8 are connected to wall structures 6.

FIG. 1 furthermore shows the two main flow directions of a coolantstarting from the top downwards and then following approximate channelsformed by the wall structures 6.

The electronic power system 1 may, of course, comprise a plurality ofelectronic power modules 2 which may be provided with a coolant by acommon coolant distributor as will be shown in one of the laterembodiments.

The wall structures 6 here comprise each at least one stabilizing wallelement 9 that does not change direction at least one third of theextension of the base plate along that direction.

FIG. 2 shows a second embodiment of an electronic power system 1according to the invention. The electronic power module 2 here againcomprises a base plate 3 having a different cooling structure 4 comparedto the previous embodiment. Here, the cooling structure 4 comprises fourwall structures 6. One of the wall structures 6 comprises fourstabilizing wall elements 9 which limit the cooling structure 4 in thetransversal plane. The other wall structures 6 are arranged inside thelimiting wall structure 6. The wall structures 6 form an interleavedcomb pattern for guiding the flow of the coolant along the coolingstructure 4. In this embodiment all wall elements are arranged eitherparallel or perpendicular to one another.

FIGS. 3a and 3b show a similar embodiment to FIG. 2. Here, theelectronic power module 2 is shown from the second side in FIG. 3a andfrom the first side of the base plate 3 in FIG. 3 b.

In FIG. 4 a common coolant distributor 10 for three electronic powermodules 2 according to FIGS. 3a and 3b is shown. The common coolantdistributor 10 comprises three depressions 11 each arranged toaccommodate a cooling structure 4 of an electronic power module 2. Ineach depression 11 one distributor inlet 12 and one distributor outlet13 is arranged.

FIG. 5 shows a fourth embodiment of a base plate 3 for an electronicpower system 1. The other parts of the electronic power module 2 and theelectronic power system 1 are omitted for simplicity. The base plate 3here again comprises a cooling structure 4. The cooling structure 4 herecomprises eight wall structures 6. The wall structures 6 each compriseone stabilizing wall element 9 that runs towards a common centerlocation 14. For each stabilizing wall element 9 there is one otherstabilizing wall element 9 that runs parallel and two other stabilizingwall elements 9 that run perpendicular. The wall structures 6 form apolar comb pattern between neighboring stabilizing wall elements 9around the common center location 14.

FIG. 6 shows a fifth embodiment according to the invention. The baseplate 3 here comprises a cooling structure 4 that has a similar radialgeometry to the embodiment according to FIG. 5. The main difference inthis case is that the base plate 3 as well as the cooling structure 4has a rectangular shape in the plane of the cooling structure 4.

FIG. 7 shows an arrangement of twelve base plates 3 according to theembodiment of FIG. 6 arranged adjacent to one another. All otherelements of the electronic power modules 2 are again omitted forsimplicity.

FIG. 8 shows the same embodiment as FIG. 7, where in addition a commoncoolant distributor 10 is placed on top of the cooling structures 4 toprovide the electronic power modules 2 with a coolant as well as toaccept the heated coolant flowing out of the cooling structures 4. Inthis case, the common coolant distributor 10 provides three adjacentcooling structures 4 with coolant through three neighboring distributoroutlets 13. The distributor outlets 13 are here arranged such that thecold coolant enters the cooling structures 4 at the common centerlocation 14 of each of the cooling structures 4. The heated coolant thenexits the cooling structures 4 at the distributor inlet 12. Here, eachdistributor inlet 13 is connected to several adjacent cooling structures4 of adjacent electronic power modules 2.

FIG. 9 shows a flow diagram of the method of manufacture according tothe invention. According to the method a raw base plate is firstprovided. Then the cooling structure 4 is formed on the second side ofthe raw base plate such that the cooling structure 4 is an integral partof the base plate 3. This forming process may for example be carried outby cold forging. Alternatively, the cooling structure 4 may also beformed by hot forging, etching, milling, 3D printing, additivemanufacturing, sintering, injection molding, casting or eroding.

Then the at least one heat generating component is fixed to the firstside of the base plate. Thereby an electronic power system 1 comprisingat least one electronic power module 2 is manufactured. The electronicpower module comprises a base plate and at least one heat generatingcomponent arranged on a first side of the base plate 3. The electronicpower module 2 comprises a cooling structure 4 for transporting heataway from the electronic power module 2 via a coolant that is guided bythe cooling structure 4. The cooling structure 4 is arranged on a secondside 5 of the base plate 3 opposite to the first side.

While the present disclosure has been illustrated and described withrespect to a particular embodiment thereof, it should be appreciated bythose of ordinary skill in the art that various modifications to thisdisclosure may be made without departing from the spirit and scope ofthe present disclosure.

What is claimed is:
 1. An electronic power system comprising at leastone electronic power module, wherein the electronic power modulecomprises a base plate and at least one heat generating componentarranged on a first side of the base plate, wherein the electronic powermodule comprises a cooling structure for transporting heat away from theelectronic power module via a coolant that is guided by the coolingstructure, and wherein the cooling structure is arranged on a secondside of the base plate opposite to the first side, wherein the coolingstructure is integrally formed with the base plate.
 2. The electronicpower system according to claim 1, wherein the cooling structurecomprises at least one wall structure for stiffening the base plate anddirecting a coolant along the cooling structure.
 3. The electronic powersystem according to claim 1, wherein at least one of the wall structurescomprises at least one stabilizing wall element, wherein the stabilizingwall element does not change direction for at least one third of theextension of the base plate along that direction.
 4. The electronicpower system according to claim 3, wherein the electronic power modulecomprises at least two stabilizing wall elements that are arranged at arelative angle between 60° and 120°.
 5. The electronic power systemaccording to claim 3, wherein the cooling structure is limited in thetransversal plane by at least three stabilizing wall elements.
 6. Theelectronic power system according to claim 1, wherein the coolingstructure comprises at least two wall structures that form aninterleaved comb pattern for guiding the flow of the coolant along thecooling structure and stabilizing the base plate.
 7. The electronicpower system according to claim 2, wherein the cooling structurecomprises both wall structures and transversally isolated pins.
 8. Theelectronic power system according to claim 3, wherein the coolingstructure comprises at least three wall structures each of whichcomprises at least one stabilizing wall element, wherein the at leastthree stabilizing wall elements extend radially towards a common centerlocation.
 9. The electronic power system according to claim 8, whereinthe wall structures form a polar comb pattern between neighboringstabilizing wall elements around the common center location.
 10. Theelectronic power system according to claim 1, wherein the electronicpower system comprises at least two electronic power modules and acommon coolant distributor, wherein the common coolant distributorcomprises at least one distributor inlet and at least one distributoroutlet connected to each electronic power module.
 11. The electronicpower system according to claim 10, wherein the common coolantdistributor comprises individual depressions for receiving eachelectronic power module, wherein each depression comprises at least onedistributor inlet and at least one distributor outlet.
 12. A method formanufacturing an electronic power system comprising at least oneelectronic power module, wherein the electronic power module comprises abase plate and at least one heat generating component arranged on afirst side of the base plate, wherein the electronic power modulecomprises a cooling structure for transporting heat away from theelectronic power module via a coolant that is guided by the coolingstructure, and wherein the cooling structure is arranged on a secondside of the base plate opposite to the first side, comprising the steps:providing a raw base plate, forming a cooling structure on the secondside of the raw base plate such that the cooling structure is anintegral part of the base plate, fixing the at least one heat generatingcomponent to the first side.
 13. The method according to claim 12,wherein the cooling structure is formed by cold forging the raw baseplate.
 14. The electronic power system according to claim 2, wherein atleast one of the wall structures comprises at least one stabilizing wallelement, wherein the stabilizing wall element does not change directionfor at least one third of the extension of the base plate along thatdirection.
 15. The electronic power system according to claim 4, whereinthe cooling structure is limited in the transversal plane by at leastthree stabilizing wall elements.
 16. The electronic power systemaccording to claim 2, wherein the cooling structure comprises at leasttwo wall structures that form an interleaved comb pattern for guidingthe flow of the coolant along the cooling structure and stabilizing thebase plate.
 17. The electronic power system according to claim 3,wherein the cooling structure comprises at least two wall structuresthat form an interleaved comb pattern for guiding the flow of thecoolant along the cooling structure and stabilizing the base plate. 18.The electronic power system according to claim 4, wherein the coolingstructure comprises at least two wall structures that form aninterleaved comb pattern for guiding the flow of the coolant along thecooling structure and stabilizing the base plate.
 19. The electronicpower system according to claim 5, wherein the cooling structurecomprises at least two wall structures that form an interleaved combpattern for guiding the flow of the coolant along the cooling structureand stabilizing the base plate.
 20. The electronic power systemaccording to claim 3, wherein the cooling structure comprises both wallstructures and transversally isolated pins.